CIRCUIT IN PLASTIC TECHNOLOGY
The Process
- Take an existing circuit design
- Machine/mould indentation in enclosure/subtrate
- Place components in indentations
- Screen print tracks on cover sheet
- Align and hot-emboss
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Assembly
- Screen printed cover sheet
- Inverted Integrated circuits
- Embossed subtrate
- Assemby
RESULT:
- Circuit and enclosure are formed simultaneously
- (The enclosure is the “circuit board”)
- Circuit sealed from the environment
- RoHS compliant
- No solder step
For more information contact David Thiel, d.thiel@griffith.edu.au
