<<<Click to view to all technologies

69

Desiccants integrated directly into a polymer composite can be injection molded into a functional component of the device, serving dual purposes. This method is ideal when the internal space to fit a desiccant is minimal.

The best time to introduce a desiccant into your product is early in the design process, but if you have a device that is experiencing issues from moisture Desiccants has experience and the expertise to evaluate your product and provide an optimized solution.

In additional to moisture management Desiccants helps with oxygen absorption as well as the adsorption of many corrosive volatiles.

Drop-In – Offers moisture, oxygen, and/or volatile protection within the sealed electronic device housing or packaging. Drop-In formats consist of desiccants, oxygen absorbers, and volatile adsorbents.

Fit-In – Integrates a secure fitting sorbent into the sealed device housing.

Built-In – Incorporates the sorbent formulation directly into the thermoplastic structural components of the device, enhancing the physical and functional properties of an existing molded component of the device.

For more information review www.multisorb.com

 

Share →

One Response to Prevention of Moisture in Electronics

  1. CT limo says:

    Hello colleagues, good piece of writing and pleasant urging commented at this place, I am actually enjoying
    by these.

    Also visit my blog post: CT limo

Leave a Reply

Your email address will not be published. Required fields are marked *