MOLDMAN Low Pressure Molding Systems
Low Pressure Molding is a gentle process to encapsulate electronics without potting. Think of molding with warm honey vs. peanut butter as in Standard Injection Molding. In HMI Devices typically used for encapsulating, sealing, and protecting circuit boards.
Low Pressure Molding Materials:
- Thermoplastic, U/L 94 V-0 natural raw materials
- Solidifies by cooling
- No toxic fumes Low viscosity
- Low application pressure
- Excellent adhesive properties
- Amber, Black, and Custom Colors
