Normally cooling a FR4 PCBA requires a large heat sink when medium intensity LED’s are on the PCB. That adds interface material requiring labor intensive manual assembly.
Cooling with Thermal Clad can eliminate the need for heat sinks, cooling fans and other hardware. Also using Thermal Clad circuit board allows automated assembly which increases reliability and reduces cost.
Printed circuit layer with thickness of 1oz to 10oz (35-350 micro-m) in standard thermal clad.
Dielectric layer for electrical isolation with minimal thermal resistance
Base layer – often aluminum with thickness of 1.6mm although thickness may vary.
Thermal Clad 1-Layer 0.04 Al 5052 Alloy x 3mil Thermal Clad MP – 1 oz. Cu Foil. Part Size: 19.99 mm x 14.98 mm Circuit. Finish: SMOBC Green, LF HASL. 0.7874″ x 0.59″ Substrate Side: Brushed
For more informatio9n contact designhmi@gmail.com or go to http://www.bergquistcompany.com/
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